吕念春
工学博士
副教授、硕士生导师
焊接技术与工程系
社会兼职:
Email:lnc_65@163.com
主要研究方向
1.焊接结构及力学;
2.复合材料的断裂动力学;
3.异种金属的焊接性能及断裂行为的研究;
4.复合材料界面的断裂力学行为的研究。
主要学术成果
获奖
1.2010年辽宁省自然科学学术成果奖(论文类)二等奖1项。
代表性论著
1. Nianchun Lü , Qian Xiang, Guodong Hao, Yuntao Wang . Dynamic Solutions of Mode III Crack in Copper Matrix Composites. Emerging Materials Research. 2017, 6(1): 139-150, (SCIE)
2. Nianchun Lü , Qian Xiang, Guodong Hao, Yuntao Wang . Dynamic solutions on mode III interface cracks in bismuth-copper. Emerging Materials Research. 2016, 5(1): 67-73, (EI)
3. Nianchun Lü , Qian Xiang, Guodong Hao, Yuntao Wang . Dynamic Solutions on mode III interface cracks in Bi-copper. Emerging Materials Research. 2015, 5(1): (EI)
4. Nianchun Lü , Qian Xiang, Guodong Hao, Yuntao Wang . Dynamic mode III interface crack in aluminum matrix composites. Emerging Materials Research. 2015, 4(1): 139-146.
5. Nian-chun Lü , Yun-hong Cheng , Yun-tao Wang , Jin Cheng .Asymmetrical Dynamic Propagation Problem on the Edges of Mode I Crack Subjected to Superimposed Loads. Mechanics of Advanced Materials and Structures. 2014, 21,(7): 596–606. (SCI、EI)
6. Nian-chun Lü , Qian Xiang, Guo-dong Hao, Yun-tao Wang , Dynamic Propagation Problems concerning Symmetrical Mode III Interface Crack of Aluminum Alloys. Advanced Materials Research. 2014, (607): 79-82, (EI)
7. Nian-chun Lü , Qian Xiang, Guo-dong Hao,Analytical Solutions of Dynamic extension problem of mode Ⅲ semi-infinite crack subjected to moving increasing loads,Asian Journal of Chemistry.2014, 26,(17): 5495–5501. (SCI、EI)
8. Nian-chun Lü , Yun-hong Cheng , Yun-tao Wang , Jin Cheng .Dynamic Propagation Problems on the Edges of the Crack of Composite Materials Subjected to Variable Loads Pxmtn. Mechanics of Advanced Materials and Structures. 2013, 20,(9): 753–763. (SCI、EI)
9. N. C, Lü,Y. H. Cheng.X. G. Li,J. Cheng, Dynamic problem concerning mode I semi-infinite crackPropagation. Journal of Mechanics. 2013, 29,(2): 309–317. (SCI、EI)
10. N. C, Lü,X. G. Li,Y. H. Cheng. J. Cheng, Asymmetrical Dynamic Propagation Problem on the Edges of Mode III Interface Crack Subjected to Superimpose Loads. Journal of Mechanics. 2013, 29,(2): 318–326. (SCI、EI)